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Efficiency of Electroless and Galvanic Plating PWB manufacturers which are not familiar with electroless plating often have the misconception that electroless plating takes too long. On the contrary, electroless plating is faster than galvanic plating, and its volumetric efficiency is twice as much as galvanic plating. Electroless plating baths operate at the speed of 2.0 to 5.0 mm/h, 2.5 mm being the medium speed. Because of its high throwing power, a deposition thickness of 25 mm on the panel surface also assures 25 mm in the hole. That is, 10 h are needed to plate this thickness. The loading factor in electroless plating can be maintained at 4 dm2/liter.A 2500-gal (10,000-l) tank can plate about 400 m2 (4000 ft2) of panels in one shot in 10 h.That is, 400 ft2/h, or approximately 130 (18-in 24in) panels/h from a 10-m3 tank.This is equivalent to twice the speed of galvanic plating from the same volume of plating solution. When small, high-aspect-ratio holes are involved, this figure becomes more favorable to electroless plating because the current density of galvanic plating must be reduced to 10 to 12 A/ft2, which requires more than 2 h of plating for 25 mm in the hole. Figure 31.7 shows the plating racks filled with panels waiting to be placed in electroless plating tanks. In large-volume operations, the panel-racking operation is fully automated.

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Photochemical Imaging Systems Various photochemical imaging systems have been developed and tried to be put into practice.6 However, no photochemical imaging systems are used for real production today. They are all unstable and the lateral growth of conductors poses a problem for the fineline applications for which they are intended.

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110 The tank temperature oscillates with increasing amplitude and will continue to do so until the physical limitations of the heating system are reached The control system has actually caused a deterioration in performance Surely, the uncontrolled response for Kc = 0 in Fig 14 is to be preferred over the unstable response of Fig 110 This problem of stability of response will be one of our major concerns in this text for obvious reasons At present, it is sufficient to note that extreme care must be exercised in specifying control systems In the case considered, the proportional and integral control mechanism described by Eq (19~) will perform satisfactorily if KR is kept lower than some particular value, as illustrated in Figs 19 and 110.

Molded Circuit Application A handful of three-dimensional molded circuit manufacturers (or, the preferred identification, molded interconnection device or MID) have continued their quest for market with this

Plating racks filled with panels to be plated. (Photo courtesy of Adiboard, Brazil.)

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However, it is not difficult to construct examples of systems for which the addition of any amount of integral control will cause an unstable response Since integral control usually has the desirable feature of eliminating steady-state error, as it did in Fig 17, it is extremely important that we develop.

To determine what the proportional band will be, valve and kansmitter gain must be combined with the dynamic loop gain of 0.33, calculated above. In the given esample, 200 ft of pipe and fittings produce about an &psi drop at 10 gpm, leaving 12 psi across the valve. A l.O-in. valve has a C, rating of 10. At 12-psi drop, the gain of the linear valve nould be G 21 - CJG- lyofyR 0.35 mm/% 100% 0 At 10 gpm, the gain of the 15-gpm differential meter is GT = 2 (g)(z) = 8.9%/gpm Since the flow process itself has no dimensional gain, G, may be multiplied directly by GT to remove dimensions: G,GT = (0.35 gpm/ %) (8.9 %/gpm) = 3. I The proportional band required for s/4-amplitude damping is then 200 times the gain product of the dynamic and steady-state components of the loop : P = 200(0.33)(3.1) = 205% This is quite typical for a flow controller. Sotice by comparing Figs. 2.5 and 2.9 that the resistance of the piping is helpful in that it shapes the gain of the valve in a direction complementary to the flowmeter. Valve gain is higher at low flow, where the transmitter gain is lower, yielding a gain product that tends more toward uniformity than either of the multiplicands. Note also that an equalpercentage valve characteristic (Fig. 2.6) is of the opposite form, tending

product and have met with some success. (See Fig. 31.8.) There are several alternative methods to manufacture MIDs, of which the two-shot molding method can produce the most sophisticated three-dimensional interconnection devices. A part which is to be metallized (circuitized) is molded first. Then, a portion of the first mold which is not desired for metallization is surrounded by the second molding, exposing

FIGURE 31.8 An example of a three-dimensional molded circuit application, in this case a light pen for computer input. (Photo courtesy of Mitsui Pathtek.)

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only the portion desired to be metallized. This two-shot molding method can be classified further into two alternative methods, which are similar to CC-4 and AP-II. One is to use catalyzed engineering plastic for the first molding and noncatalyzed plastic for the second molding. Adhesion promotion consists of a swell-and-etch step followed by chromic acid etch. The other alternative is to mold the first part with noncatalyzed plastic materials and expose the molded part to an adhesion promotion process and catalyze. The second part is then molded, as in the first case. These parts are placed in an electroless plating bath for circuitization. A high rate of growth is expected for MIDs, with the automotive market being the most promising application area.

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